
Traditional three zone thermal shock chambers can be quite large, as three separate chambers are used. The TSA series has just one chamber, substantially reducing its size. Instead, it circulates cold, hot, or ambient air as needed. The conditioned air can be pre-cooled or pre-heated beyond the setpoint, allowing quicker recovery of the desired condition after transfer.
The TSA-71H-W is configured especially to meet the popular Mil-Std 883 1010.7 method, from -65 to 150°C.
New: Compare Thermal Shock Models
Side-by-side comparison of up to three models.
| Model / Link | Interior Dimensions (W x D x H) |
Interior Volume | Temperature Range | Notes | ||
|---|---|---|---|---|---|---|
| Click model number for details, including metric & english units. | ||||||
| TSA-41L-A | 9.4" x 14.6" x 18.1" | 1.5 cu. ft. | -65 to 200°C | Test example: -55 to 150°C in 5 min. (upstream air) with 5.5 lb. of IC chips | ||
| TSA-71L-A | 16" x 14.5" x 18" | 2.5 cu. ft. | -65 to 200°C | Test example: -55 to 150°C in 5 min. (upstream air) with 5.5 lb. of IC chips | ||
| TSA-71S-A | 16" x 14.5" x 18" | 2.5 cu. ft. | -70 to 200°C | Test example: -55 to 150°C in 5 min. (upstream air) with 11 lb. of IC chips | ||
| TSA-71S-W | 16" x 14.5" x 18" | 2.5 cu. ft. | -70 to 200°C | Test example: -65 to 150°C in 5 min. (upstream air) with 11 lb. of IC chips | ||
| TSA-71H-W | 16" x 14.5" x 18" | 2.5 cu. ft. | -70 to 200°C | Test example: -65 to 150°C in 15 min.( worst-case on -product) with 22 lb of IC chips | ||
| TSA-101L-A | 25.5" x 14.5" x 18" | 4 cu. ft. | -65 to 200°C | Test example: -55 to 150°C in 10 min. (upstream air) with 44 lb of IC chips | ||
| TSA-101S-W | 25.5" x 14.5" x 18" | 4 cu. ft. | -70 to 200°C | Test example: -65 to 150°C in 5 min. (upstream air) with 11 lb. of IC chips | ||
| TSA-201S-W | 25.5" x 26.4" x 18" | 7 cu. ft. | -70 to 200°C | Test example: -65 to 150°C in 10 min. (upstream air) with 44 lb of IC chips | ||
| TSA-301L-W | 38" x 26.4" x 18" | 10 cu. ft. | -70 to 200°C | Test example: -55 to 150°C in 10 min. (upstream air) with 53 lb of IC chips | ||