ETS Medium-to-Large Thermal Shock Chambers
Meets Mil-Std Test Specifications
The ETS thermal shock chamber is a high quality design with an advanced touch screen controller and an innovative hot/cold transfer system. It is designed to meet strict Mil-Std test specifications, which require temperature recovery to be measured in the worst-case product sample.
The touch-screen controller is user-friendly and designed especially for thermal shock. For Mil-Std 883 testing, the controller actually speeds up test time by detecting when the product has achieved temperature and can go to the next step.
ESPEC's electric screw-drive lift automatically moves the samples between hot and cold zones. This direct drive method eliminates the problems associated with cables, pneumatic cylinders, or other complicated mechanisms.
Compare Thermal Shock Models
Side-by-side comparison of up to three models.
Features
Chamber Design Features:
- Vertical-lift thermal shock chamber with separate hot and cold temperature zones
- Direct-drive system for reliable transfer between zones (maximum load 150 lb.)
- The basket carrier includes an adjustable shelf pilaster and one wire mesh specimen basket
Refrigeration and Plenum:
- Refrigeration maintains user-set low temperature in cold zone
- Two ¾ hp blower motors circulate the air (one per zone)
- Dry air purge system extends the time between defrost cycles
- Non-CFC cascade refrigeration system using semi-hermetic Copeland Discus compressors
- Hinged service access doors with lockable snap-action latches
- Sound levels below 70 dBa
- Three levels of overheat protection
ESPEC’s Exclusive SCP-220TS Programmer:
- User-friendly touch-screen operation with 6.5" color display
- The trend-graph display shows a record of setpoints and actual values
- Cycle-time reduction function in compliance with Mil-Std 883, 1010.7
- Product thermocouple senses when samples are at temperature to start soak time early
- 20 user-definable programs can be saved with alphanumeric names
- System alarms are stored in memory for historical review
- Activated alarms provide on-screen troubleshooting help
- Built-in timer functions allow the chamber to be started or shut down automatically
- User-set independent overheat and overcool protectors
- Computer interface RS-232
Thermal Shock
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ETS Medium-to-Large Thermal Shock Model Comparison
| Model / Link | Interior Dimensions (W x D x H) |
Interior Volume | Temperature Range | Notes | ||
|---|---|---|---|---|---|---|
| ETS4-1CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -55 to 150°C in 15 min. worst-case on-product with 30 lbs. IC chips | ||
| ETS4-2CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 20 lbs. IC chips | ||
| ETS4-3CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 40 lbs. IC chips | ||
| ETS13-3CW | 28" x 33" x 24" | 13 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 20 lbs. IC chips | ||
| ETS13-5CW | 28" x 33" x 24" | 13 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 40 lbs. IC chips | ||
| Click model number for details, including metric & english units. | ||||||